Vehicle vision system with forward viewing camera

ABSTRACT

A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.

CROSS REFERENCE TO RELATED APPLICATION

The present application claims the filing benefits of U.S. provisionalapplication Ser. No. 61/990,927, filed May 9, 2014, which is herebyincorporated herein by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates generally to a vehicle vision system for avehicle and, more particularly, to a vehicle vision system that utilizesone or more cameras at a vehicle.

BACKGROUND OF THE INVENTION

Use of imaging sensors in vehicle imaging systems, such as for machinevision applications in vehicles, is known. Packaging of forward facingimagers is also known, such as described in U.S. Pat. Nos. 7,262,406;7,265,342; 7,420,159; 7,480,149; 7,533,998; 7,538,316; 7,916,009;8,179,437 and/or 8,405,726, which are hereby incorporated herein byreference in their entireties. Examples of known vision systems aredescribed in U.S. Pat. Nos. 8,324,552; 8,314,689; 8,289,142; 8,222,588;8,239,086; 8,203,440; 7,994,462; 7,655,894; 7,339,149; 7,344,261;7,459,664; 7,423,248; 6,097,023; 5,949,331; 5,670,935 and 5,550,677,which are hereby incorporated herein by reference in their entireties.

SUMMARY OF THE INVENTION

The present invention provides a vision system or imaging system for avehicle that utilizes one or more cameras to capture images exterior ofthe vehicle, and provides the communication/data signals, includingcamera data or image data, which may be displayed or processed toprovide the desired display images and/or processing and control,depending on the particular application of the camera and vision orimaging system. The camera module is configured to attach at the vehiclewindshield and an interior rearview mirror assembly may attach at themodule or at a bracket of the module. The camera module includes athermal element that attaches at an imager assembly with a thermallyconductive pad engaging the imager circuit board or PCB and engaging thecamera module housing, so as to provide thermal transfer of heatgenerated by said imager and imager PCB during operation of the imageraway from the imager and imager PCB and to the outer casing or housingof the camera module. The present invention thus provides enhancedthermal transfer and dissipation of heat generated by the camera duringoperation and thus may provide enhanced performance of the camera,particularly during operation of the camera at high ambient temperaturesand the like.

These and other objects, advantages, purposes and features of thepresent invention will become apparent upon review of the followingspecification in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a vehicle having a vehicular camerasystem and forward facing camera of the present invention;

FIG. 2 is a side sectional view of the forward facing camera module ofthe present invention, shown with the thermal pad or element disposed atand engaging the imager PCB and the outer case or housing of the cameramodule;

FIG. 3 is an enlarged sectional view of the thermal pad or element ofFIG. 2, showing the heat transfer from the imager to outside of thecamera module;

FIG. 4 is another enlarged sectional view of the thermal pad or element,showing attachment of the thermal pad or element at the imager PCB;

FIGS. 5 and 6 are perspective views of the thermal pad or element of thepresent invention;

FIG. 7 is a perspective view of the thermal pad or element, shownattached at the imager PCB;

FIG. 8 shows how the thermal pad or element of the present invention isattached at the imager assembly and imager PCB; and

FIG. 9 shows how the imager assembly, with the thermal pad or elementattached thereto, is attached at the camera module casing or housing.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A vehicular camera system can be installed on the inside of the frontwindshield of a vehicle, such as a car, truck, bus, or van. Such acamera system may be used for a variety of functions such as objectdetection, lane keeping, and high beam control. FIG. 1 shows an exampleof a vehicular camera system or module 10 configured to be attached in afront-facing manner to a vehicle 12, such as at a windshield 14 of avehicle 12. The camera system 10 includes an imager assembly 16, whichhas an imager 18 established at an imager circuit board or PCB 20, andan imager housing or structure 22 and a lens barrel 24 attached at thestructure 22 and optically aligned at and focused at the imager 18 (FIG.2). The camera module 10 includes a thermal element or pad or bridge orconduit 26 that is attached at or disposed at the imager PCB 20 tothermally conductively connect the imager PCB 20 to the outer housing orcasing 28 of the camera module 10, as discussed below.

The camera system or camera module of the present invention may utilizeaspects of the systems and/or modules described in InternationalPublication Nos. WO 201 3/123161 and/or WO 2013/019795, and/or U.S. Pat.Nos. 8,256,821; 7,480,149; 7,289,037; 7,004,593; 6,824,281; 6,690,268;6,445,287; 6,428,172; 6,420,975; 6,326,613; 6,278,377; 6,243,003;6,250,148; 6,172,613 and/or 6,087,953, and/or U.S. Publication Nos.US-2014-0226012 and/or US-2009-0295181, which are all herebyincorporated herein by reference in their entireties.

The imager structure or housing 22 is configured to support the imagerPCB 20 and lens barrel 24 so that the imager assembly 16 is attachableor mountable at the module housing or casing 28 as a unit. In theillustrated embodiment, the housing 22 is configured to attach at anupper housing portion of module casing 28, whereby the lens barrel isangled relative to the upper housing portion of casing 28 and relativeto a main or primary or module circuit board 32 in the camera modulecasing 28. The imager assembly 16 includes an electrical connector 30that extends from the imager circuit board 20 for electrical connectionto the module circuit board 32 when the imager assembly is disposed ator in the module.

The front camera module is widely used to the automotive industry forvehicle detection and accident avoidance. One challenge is to maintainthe imager's operating temperature within an acceptable range evenduring operation at high ambient temperatures (such as during operationof the camera on a hot sunny day, where the vehicle cabin at or near thewindshield often reaches temperatures in excess of 100 degrees F.). Athermal pad may be sandwiched between the PCB and the outer case orhousing, in order to draw the heat from the component to the outerambient temperature. This method is not typically suitable for use witha forward facing camera module application, because the imager PCB isnot parallel to the outer cover.

The present invention keeps the imager below its maximum operationaltemperature at high ambient temperatures, without parallel surfaces forthermal conduction. The present invention provides a thermal element orheat pipe 26 that is clipped or otherwise attached to or disposed at theimager assembly 16 (such as clipped to the imager structure or housingand in contact with or in close proximity to the imager PCB). Thethermal element 26 comprises a thermal pad or sil pad 26 a that isdisposed at a clip or support element 26 b (such as a metallic orplastic or polymeric element or the like), which attaches at the imagerassembly 16. When so attached, the heat pipe thermally connects thethermal pad or sil pad to the imager PCB. The imager assembly is theninstalled into the outer cover, which thermally connects the thermal pador sil pad to the outer cover. These two connections allow the heat totravel from the imager PCB to outside the camera, thus cooling theimager (see FIGS. 2 and 3).

The thermal element or heat pipe of the present invention equalizes thesil pad pressure between both the outer case and the imager PCB. Becausethe thermal clip is attached to the imager PCB and allowed to rotate,the pressure is equalized between the upper case and the imager assembly(such as can be seen with reference to FIG. 4).

As shown with reference to FIGS. 4-8, the thermal pad 26 a of thermalelement 26 is disposed along the clip 26 b, with the clip 26 b having apair of tabs or arms 26 c that are configured to attach or clip or snaponto the imager housing or structure 22. For example, and as shown inFIG. 8, the arms 26 c may be configured to hook over attaching portionsof the imager housing 22, whereby the thermal element may be pivoted atthe imager PCB to snap or clip the arms onto the housing to hold thethermal pad 26 a against the back surface of the imager PCB 20, withsubstantially uniform pressure at the thermal pad where it engages theimager PCB. When so attached, a first or PCB portion of the clip 26 band pad 26 a extend along the imager PCB 20 and a second or casingportion of the clip and pad extend at an angle relative to the imagerPCB, whereby, when the imager assembly 16 (with the thermal elementattached or clipped thereto) is attached at the camera housing 28 (suchas via fasteners or the like) such as shown in FIG. 9, the secondportion of the pad 26 a engages the camera housing 28 (which isnon-parallel to the imager PCB), such as shown in FIGS. 2-4. When theimager assembly is so attached or fastened at the camera module orhousing, the electrical connector 30 of the imager PCB 20 may beelectrically connected to or plugged into a corresponding connector ofthe main PCB 32 of the camera module (such as shown in FIG. 2) toelectrically connect circuitry of the imager PCB with circuitry of themain PCB of the camera module.

Thus, and as can be seen with reference to FIG. 3, the thermal pad 26 aallows for heat transfer of heat produced or generated by the imager 18at the imager PCB 20 (during operation of the imager) along the thermalpad 26 a and to the outer housing 28 and thus to the outside or exteriorof the camera assembly. The configuration of the thermal element, whenattached at the imager PCB and engaged at the outer case, providespressure contact with the rear surface of the imager PCB and with theinterior surface of the outer case, thereby providing enhanced thermalconduction between the imager PCB and the outer case. The thermal padmay comprise any suitable material, and preferably is compressible sothat the pad may compress when engaged with the imager PCB and the outercase to enhance the contacts (and preferably is electrically isolatingor non-electrically conducting). For example, the thermal pad materialmay comprise a Gap Pad VO Ultra Soft material, commercially availablefrom The Bergquist Company of Chanhassen, Minn., or a THERM-A-GAP HCS10material, commercially available from Parker Hannifin of Cleveland,Ohio, or the like. Optionally, the outer housing 28 may include slots orapertures or fins or the like at the region where the thermal padcontacts the housing to enhance heat transfer and dissipation of thetransferred heat at the outer housing.

Therefore, the present invention provides a thermal element or heattransfer element that is disposed between and in contact with the imagerPCB of the imager assembly and the outer housing or casing of the cameramodule. The thermal element is attached or clipped to the imagerassembly so that a thermal pad portion is substantially uniformlyengaged with the imager PCB, and the thermal element is configured suchthat, when the imager assembly is attached at the camera module orhousing, another thermal pad portion of the thermal element engages oris pressed against the camera housing so that the thermal pad of thethermal element or clip provides thermal connection or conductivity or athermal pipe or conduit between the imager PCB and the camera module'souter housing or casing. Optionally, a thermally conductive paste may bedisposed at the imager PCB and/or at the inner surface of the housing(at the points of contact of the thermal pad) to enhance thermalconductivity to and from the thermal pad. Thus, the present inventionprovides for enhanced thermal control of the imager assembly and thusenhanced operation of the imager assembly and forward facing camera, bydrawing heat away from the imager PCB during operation of the camera.Although shown as a clip or element that attaches at an imager PCB todraw heat from the imager PCB, the thermal element may clip or attach ator to other electronic elements (such as at PCBs of other imagers orrain sensors or photosensors or other electronic accessories or thelike) to draw heat away from the respective PCB to a respective outerhousing or structure (that may be non-parallel to the PCB) duringoperation of the respective element or accessory, while remaining withinthe spirit and scope of the present invention.

The forward facing camera module is configured to attach at a mountingbracket that is configured to attach at the vehicle windshield, such asvia direct adhesive attachment of the bracket to the windshield or viaattachment of the bracket to one or more attaching elements that areadhesively attached at the windshield (such as by utilizing aspects ofthe modules described in U.S. Publication Nos. US-2014-0226012 and/orUS-2009-0295181, which are hereby incorporated herein by reference intheir entireties). Although not shown, the mirror mounting portion maybe made larger to enhance attachment of the bracket at the windshieldsurface. A suitable adhesive joint to directly attach the bracket to thewindshield (or to attach the likes of three or four attachmentposts/pins/elements to hold the bracket at the windshield) is formed bycuring 3M structural bonding tapes (such as 9214, or 9270 or 9263) in anautoclave process during fabrication of a laminated windshield such asdisclosed in U.S. Pat. No. 5,587,236, which is hereby incorporatedherein by reference in its entirety. Such 3M structural bonding tapesare available from 3M Company of St. Paul, Minn. and are modified epoxyadhesive tapes. Alternately, a urethane or a silicone adhesive can beused.

The camera module comprises the outer housing that houses the camera orimager assembly, and may include a stray light baffle or shield attachedat the housing. The camera module, and its housing and camera andshield, may be similar to the camera module components described in U.S.Publication No. US-2014-0226012, and/or International Publication Nos.WO 2013/123161 and/or WO 2013/019795, which are hereby incorporatedherein by reference in their entireties.

The camera module may attach at the bracket via any suitable means, andmay detachably attach so that the camera module may be detached forservice or replacement while the bracket remains attached at thewindshield surface. When mounted at the bracket that is attached at thewindshield of the vehicle, the stray light shield is disposed generallyat the in-cabin surface of the windshield so that the camera viewsthrough or across the recess established by the light shield and throughthe windshield, such as through an aperture or region of the windshieldthat is devoid of an opaque hiding layer or frit layer or the like.Further, a shield gasket may be positioned on the frame or bracketaround the lens to reduce incursion of dust, particulate, or moistureinto the vicinity of the lens. The gasket may utilize aspects of thegaskets described in U.S. patent application Ser. No. 12/393,223, filedFeb. 26, 2009, which is hereby incorporated herein by reference in itsentirety. Optionally, the system may have a separate light shield or thelight shield may be part of the bracket itself, such as by utilizingaspects of the systems described in U.S. Pat. No. 6,824,281, which ishereby incorporated herein by reference in its entirety.

Because of the number of components established at the main circuitboard of the camera module, it is desirable to have the main circuitboard comprise a double sided PCB with circuitry and componentsestablished at both sides of the circuit board. The flexible connectoror cable of the imager assembly provides LVDS signals conveying imagedata captured by the imager to the image processor of the main circuitboard. Alternately, image data captured by the imager may be conveyed tothe image processor via the likes of Ethernet or by the protocolsdescribed in U.S. Pat. No. 7,697,027, which is hereby incorporatedherein by reference in its entirety. The aperture or opening or hole inthe main circuit board provides for passage of the flexible connectorthrough the circuit board so as to establish electrical connection tothe opposite side of the main circuit board, and the aperture or openingor hole in the main circuit board also at least partially receives aportion of imager assembly (such as a portion of the imager circuitboard and/or imager and/or lens holder and/or lens) to provide a lowerprofile camera system or module.

Optionally, the camera module may include ventilation means forventilating the module at the windshield (such as by utilizing aspectsof the modules described in U.S. Publication No. US-2009-0295181 and/orU.S. patent application Ser. No. 12/393,223, filed Feb. 26, 2009, whichare hereby incorporated herein by reference in their entireties). Forexample, the ventilation means may comprise one or more vents or portsor ventilation openings (such as a vent or port or opening establishedthrough the housing and/or gasket and/or frame or the like), a gaspermeable and fluid impermeable material, a baffle that passes air andthat blocks moisture, and/or a breathable membrane and/or the like. Suchventilation means may be provided to reduce moisture or fogging of thewindshield at the viewing area of the camera or imager. Optionally, alocalized heater element or grid may be established at the windshield(such as a conductive trace, such as a transparent conductive trace orthe like, established at the in-cabin surface of the windshield local tothe camera module) to provide heating of the windshield at the areathrough which the camera views, in order to reduce moisture or foggingof the windshield at the viewing area of the camera or imager.

The vision system that utilizes the forward facing camera may alsoinclude one or more other imaging sensors or cameras (such as a rearwardfacing imaging sensor or camera and/or a forwardly facing camera at thefront of the vehicle, and/or a sidewardly/rearwardly facing camera atthe sides of the vehicle), which capture images exterior of the vehicle,with the cameras having a lens for focusing images at or onto an imagingarray or imaging plane of the camera. The vision system is operable toprocess image data captured by the cameras and may provide displayedimages at a display device for viewing by the driver of the vehicle.Optionally, the vision system may process image data to detect objects,such as objects forward of the vehicle during forward driving or such asobjects to the rear of the subject or equipped vehicle during areversing maneuver, or such as approaching or following vehicles orvehicles at a side lane adjacent to the subject or equipped vehicle orthe like.

Optionally, the module 10 and camera may utilize aspects of the imagingsystems and/or modules described in U.S. Pat. Nos. 8,451,332; 8,256,821;7,946,505; 7,188,963; 7,004,593; 6,824,281; 6,968,736; 6,690,268;6,250,148; 6,341,523; 6,593,565; 6,428,172; 6,501,387; 6,329,925 and/or6,326,613, and/or in U.S. Publication No. US-2006-0050018, which arehereby incorporated herein by reference in their entireties. Optionally,the forward facing camera may be disposed at a module that is spacedfrom the windshield, such as at or near or part of the interior rearviewmirror assembly, or the forward facing camera may be disposed at or inthe interior rearview mirror assembly that is attached at an in-cabinportion of the vehicle, while remaining within the spirit and scope ofthe present invention.

The windshield may have an opaque or light absorbing ornon-light-transmitting layer (such as an opaque ceramic frit layer orthe like) disposed at the area of the windshield at which the bracket ismounted, with an aperture established through the opaque layer generallyat the area in front of and generally aligned with the imager assemblywhen the bracket and camera housing are attached at the windshield andwith the same aperture or a second aperture also aligned with any rainsensor used, so that the camera and the rain sensor can view through thewindshield through the aperture or apertures formed through the opaquefrit layer.

When the camera module is attached at the bracket at the windshield, theimager assembly has a field of view through the aperture in the opaquelayer at the windshield W, with no obstruction in the field of view ofthe imager. The field of view of the imager is set (such as by thebracket configuration) to be at or slightly above horizontal (such as,for example, at about 0.5 degrees or more above horizontal or about 1degree above horizontal or at about 2 degrees above horizontal orthereabouts), with the field of view of the imager encompassing theground ahead of the equipped vehicle at less than about 7 m from theimager. The stray light shield is arranged so that it extends from thelens of the imager to where the field of view of the imager crosses thewindshield. The camera module and bracket configuration also provide forthe imager to be mounted at the windshield at a location that is areduced distance from the windshield (such as less than about 4 mm,preferably less than about 2 mm and preferably about 2.0+/−1.9 mm orthereabouts).

The camera or sensor may comprise any suitable camera or sensor.Optionally, the camera may comprise a “smart camera” that includes theimaging sensor array and associated circuitry and image processingcircuitry and electrical connectors and the like as part of a cameramodule, such as by utilizing aspects of the vision systems described inInternational Publication Nos. WO 2013/081984 and/or WO 2013/081985,which are hereby incorporated herein by reference in their entireties.

The vehicle and/or vision system includes an image processor operable toprocess image data captured by the camera or cameras, such as fordetecting objects or other vehicles or pedestrians or the like in thefield of view of one or more of the cameras. For example, the imageprocessor may comprise an EyeQ2 or EyeQ3 image processing chip availablefrom Mobileye Vision Technologies Ltd. of Jerusalem, Israel, and mayinclude object detection software (such as the types described in U.S.Pat. Nos. 7,855,755; 7,720,580 and/or 7,038,577, which are herebyincorporated herein by reference in their entireties), and may analyzeimage data to detect vehicles and/or other objects. Responsive to suchimage processing, and when an object or other vehicle is detected, thesystem may generate an alert to the driver of the vehicle and/or maygenerate an overlay at the displayed image to highlight or enhancedisplay of the detected object or vehicle, in order to enhance thedriver's awareness of the detected object or vehicle or hazardouscondition during a driving maneuver of the equipped vehicle.

The vehicle may include any type of sensor or sensors, such as imagingsensors or radar sensors or lidar sensors or ladar sensors or ultrasonicsensors or the like. The imaging sensor or camera may capture image datafor image processing and may comprise any suitable camera or sensingdevice, such as, for example, a two dimensional array of a plurality ofphotosensor elements arranged in at least 640 columns and 480 rows (atleast a 640×480 imaging array, such as a megapixel imaging array or thelike), with a respective lens focusing images onto respective portionsof the array. The photosensor array may comprise a plurality ofphotosensor elements arranged in a photosensor array having rows andcolumns. Preferably, the imaging array has at least 300,000 photosensorelements or pixels, more preferably at least 500,000 photosensorelements or pixels and more preferably at least 1 million photosensorelements or pixels. The imaging array may capture color image data, suchas via spectral filtering at the array, such as via an RGB (red, greenand blue) filter or via a red/red complement filter or such as via anRCC (red, clear, clear) filter or the like. The logic and controlcircuit of the imaging sensor may function in any known manner, and theimage processing and algorithmic processing may comprise any suitablemeans for processing the images and/or image data.

For example, the vision system and/or processing and/or camera and/orcircuitry may utilize aspects described in U.S. Pat. Nos. 7,005,974;5,760,962; 5,877,897; 5,796,094; 5,949,331; 6,222,447; 6,302,545;6,396,397; 6,498,620; 6,523,964; 6,611,202; 6,201,642; 6,690,268;6,717,610; 6,757,109; 6,802,617; 6,806,452; 6,822,563; 6,891,563;6,946,978; 7,859,565; 5,550,677; 5,670,935; 6,636,258; 7,145,519;7,161,616; 7,230,640; 7,248,283; 7,295,229; 7,301,466; 7,592,928;7,881,496; 7,720,580; 7,038,577; 6,882,287; 5,929,786 and/or 5,786,772,and/or International Publication Nos. WO 2011/028686; WO 2010/099416; WO2012/061567; WO 2012/068331; WO 2012/075250; WO 2012/103193; WO2012/0116043; WO 2012/0145313; WO 2012/0145501; WO 2012/145818; WO2012/145822; WO 201 2/1 581 67; WO 2012/075250; WO 2012/0116043; WO2012/0145501; WO 2012/154919; WO 2013/019707; WO 2013/016409; WO2013/019795; WO 2013/067083; WO 2013/070539; WO 2013/043661; WO2013/048994; WO 2013/063014, WO 2013/081984; WO 2013/081985; WO2013/074604; WO 2013/086249; WO 2013/103548; WO 2013/109869; WO2013/123161; WO 2013/126715; WO 2013/043661 and/or WO 2013/158592, whichare all hereby incorporated herein by reference in their entireties. Thesystem may communicate with other communication systems via any suitablemeans, such as by utilizing aspects of the systems described inInternational Publication Nos. WO/2010/144900; WO 2013/043661 and/or WO2013/081985, and/or U.S. Publication No. US-2012-0062743, which arehereby incorporated herein by reference in their entireties.

The imaging device and control and image processor and any associatedillumination source, if applicable, may comprise any suitablecomponents, and may utilize aspects of the cameras and vision systemsdescribed in U.S. Pat. Nos. 5,550,677; 5,877,897; 6,498,620; 5,670,935;5,796,094; 6,396,397; 6,806,452; 6,690,268; 7,005,974; 7,937,667;7,123,168; 7,004,606; 6,946,978; 7,038,577; 6,353,392; 6,320,176;6,313,454 and 6,824,281, and/or International Publication Nos. WO2010/099416; WO 2011/028686; and/or WO 2013/016409, and/or U.S.Publication Nos. US 2010-0020170 and/or US-2013-0002873, which are allhereby incorporated herein by reference in their entireties. The cameraor cameras may comprise any suitable cameras or imaging sensors orcamera modules, and may utilize aspects of the cameras or sensorsdescribed in U.S. Publication No. US-2009-0244361 and/or U.S. Pat. Nos.8,542,451; 7,965,336 and/or 7,480,149, which are hereby incorporatedherein by reference in their entireties. The imaging array sensor maycomprise any suitable sensor, and may utilize various imaging sensors orimaging array sensors or cameras or the like, such as a CMOS imagingarray sensor, a CCD sensor or other sensors or the like, such as thetypes described in U.S. Pat. Nos. 5,550,677; 5,670,935; 5,760,962;5,715,093; 5,877,897; 6,922,292; 6,757,109; 6,717,610; 6,590,719;6,201,642; 6,498,620; 5,796,094; 6,097,023; 6,320,176; 6,559,435;6,831,261; 6,806,452; 6,396,397; 6,822,563; 6,946,978; 7,339,149;7,038,577; 7,004,606; 7,720,580 and/or 7,965,336, and/or InternationalPublication Nos. WO/2009/036176 and/or WO/2009/046268, which are allhereby incorporated herein by reference in their entireties.

The camera module and circuit chip or board and imaging sensor may beimplemented and operated in connection with various vehicularvision-based systems, and/or may be operable utilizing the principles ofsuch other vehicular systems, such as a vehicle headlamp control system,such as the type disclosed in U.S. Pat. Nos. 5,796,094; 6,097,023;6,320,176; 6,559,435; 6,831,261; 7,004,606; 7,339,149 and/or 7,526,103,which are all hereby incorporated herein by reference in theirentireties, a rain sensor, such as the types disclosed in commonlyassigned U.S. Pat. Nos. 6,353,392; 6,313,454; 6,320,176 and/or7,480,149, which are hereby incorporated herein by reference in theirentireties, a vehicle vision system, such as a forwardly, sidewardly orrearwardly directed vehicle vision system utilizing principles disclosedin U.S. Pat. Nos. 5,550,677; 5,670,935; 5,760,962; 5,877,897; 5,949,331;6,222,447; 6,302,545; 6,396,397; 6,498,620; 6,523,964; 6,611,202;6,201,642; 6,690,268; 6,717,610; 6,757,109; 6,802,617; 6,806,452;6,822,563; 6,891,563; 6,946,978; 7,005,974 and/or 7,859,565, which areall hereby incorporated herein by reference in their entireties, areverse or sideward imaging system, such as for a lane change assistancesystem or lane departure warning system or for a blind spot or objectdetection system, such as imaging or detection systems of the typesdisclosed in U.S. Pat. Nos. 7,881,496; 7,720,580; 7,038,577; 5,929,786and/or 5,786,772, which are hereby incorporated herein by reference intheir entireties, a video device for internal cabin surveillance and/orvideo telephone function, such as disclosed in U.S. Pat. Nos. 5,760,962;5,877,897; 6,690,268 and/or 7,370,983, and/or U.S. Publication No.US-2006-0050018, which are hereby incorporated herein by reference intheir entireties, a traffic sign recognition system, a system fordetermining a distance to a leading or trailing vehicle or object, suchas a system utilizing the principles disclosed in U.S. Pat. Nos.6,396,397 and/or 7,123,168, which are hereby incorporated herein byreference in their entireties, and/or the like.

Optionally, the circuit board or chip may include circuitry for theimaging array sensor and or other electronic accessories or features,such as by utilizing compass-on-a-chip or EC driver-on-a-chip technologyand aspects such as described in U.S. Pat. Nos. 7,255,451 and/or7,480,149, and/or U.S. Publication Nos. US-2010-0097469 and/orUS-2006-0061008, which are hereby incorporated herein by reference intheir entireties.

Optionally, the vision system may include a display for displayingimages captured by one or more of the imaging sensors for viewing by thedriver of the vehicle while the driver is normally operating thevehicle. Optionally, for example, the vision system may include a videodisplay device disposed at or in the interior rearview mirror assemblyof the vehicle, such as by utilizing aspects of the video mirror displaysystems described in U.S. Pat. No. 6,690,268 and/or U.S. Publication No.US-2012-0162427, which are hereby incorporated herein by reference intheir entireties. The video mirror display may comprise any suitabledevices and systems and optionally may utilize aspects of the compassdisplay systems described in U.S. Pat. Nos. 7,370,983; 7,329,013;7,308,341; 7,289,037; 7,249,860; 7,004,593; 4,546,551; 5,699,044;4,953,305; 5,576,687; 5,632,092; 5,677,851; 5,708,410; 5,737,226;5,802,727; 5,878,370; 6,087,953; 6,173,508; 6,222,460; 6,513,252 and/or6,642,851, and/or European patent application, published Oct. 11, 2000under Publication No. EP 0 1043566, and/or U.S. Publication No.US-2006-0061008, which are all hereby incorporated herein by referencein their entireties. Optionally, the video mirror display screen ordevice may be operable to display images captured by a rearward viewingcamera of the vehicle during a reversing maneuver of the vehicle (suchas responsive to the vehicle gear actuator being placed in a reversegear position or the like) to assist the driver in backing up thevehicle, and optionally may be operable to display the compass headingor directional heading character or icon when the vehicle is notundertaking a reversing maneuver, such as when the vehicle is beingdriven in a forward direction along a road (such as by utilizing aspectsof the display system described in International Publication No. WO2012/051500, which is hereby incorporated herein by reference in itsentirety).

Optionally, the vision system (utilizing the forward facing camera and arearward facing camera and other cameras disposed at the vehicle withexterior fields of view) may be part of or may provide a display of atop-down view or birds-eye view system of the vehicle or a surround viewat the vehicle, such as by utilizing aspects of the vision systemsdescribed in International Publication Nos. WO 2010/099416; WO2011/028686; W02012/075250; WO 2013/019795; WO 2012/075250; WO2012/145822; WO 2013/081985; WO 2013/086249 and/or WO 2013/109869,and/or U.S. Publication No. US-2012-0162427, which are herebyincorporated herein by reference in their entireties.

Optionally, a video mirror display may be disposed rearward of andbehind the reflective element assembly and may comprise a display suchas the types disclosed in U.S. Pat. Nos. 5,530,240; 6,329,925;7,855,755; 7,626,749; 7,581,859; 7,446,650; 7,370,983; 7,338,177;7,274,501; 7,255,451; 7,195,381; 7,184,190; 5,668,663; 5,724,187 and/or6,690,268, and/or in U.S. Publication Nos. US-2006-0061008 and/orUS-2006-0050018, which are all hereby incorporated herein by referencein their entireties. The display is viewable through the reflectiveelement when the display is activated to display information. Thedisplay element may be any type of display element, such as a vacuumfluorescent (VF) display element, a light emitting diode (LED) displayelement, such as an organic light emitting diode (OLED) or an inorganiclight emitting diode, an electroluminescent (EL) display element, aliquid crystal display (LCD) element, a video screen display element orbacklit thin film transistor (TFT) display element or the like, and maybe operable to display various information (as discrete characters,icons or the like, or in a multi-pixel manner) to the driver of thevehicle, such as passenger side inflatable restraint (PSIR) information,tire pressure status, and/or the like. The mirror assembly and/ordisplay may utilize aspects described in U.S. Pat. Nos. 7,184,190;7,255,451; 7,446,924 and/or 7,338,177, which are all hereby incorporatedherein by reference in their entireties. The thicknesses and materialsof the coatings on the substrates of the reflective element may beselected to provide a desired color or tint to the mirror reflectiveelement, such as a blue colored reflector, such as is known in the artand such as described in U.S. Pat. Nos. 5,910,854; 6,420,036 and/or7,274,501, which are hereby incorporated herein by reference in theirentireties.

Optionally, the display or displays and any associated user inputs maybe associated with various accessories or systems, such as, for example,a tire pressure monitoring system or a passenger air bag status or agarage door opening system or a telematics system or any other accessoryor system of the mirror assembly or of the vehicle or of an accessorymodule or console of the vehicle, such as an accessory module or consoleof the types described in U.S. Pat. Nos. 7,289,037; 6,877,888;6,824,281; 6,690,268; 6,672,744; 6,386,742 and/or 6,124,886, and/or U.S.Publication No. US-2006-0050018, which are hereby incorporated herein byreference in their entireties.

Changes and modifications in the specifically described embodiments canbe carried out without departing from the principles of the invention,which is intended to be limited only by the scope of the appendedclaims, as interpreted according to the principles of patent lawincluding the doctrine of equivalents.

1. A vehicle vision system comprising: a camera module configured toattach at an in-cabin surface of a windshield of a vehicle equipped withsaid vision system; wherein said camera module comprises a housing andan imager assembly; wherein said imager assembly comprises a structureand an imager and a lens, and wherein said imager is disposed at animager circuit board of said imager assembly; a thermal elementconfigured to attach at said structure of said imager assembly, whereinsaid thermal element comprises a support element and a thermal paddisposed at least partially along said support element; and wherein,with said thermal element attached at said structure of said imagerassembly, a first portion of said thermal pad is engaged with and inthermal conductivity with said imager circuit board, and wherein, withsaid imager assembly disposed at said housing of said camera module, asecond portion of said thermal pad is engaged with and in thermalconductivity with said housing.
 2. The vehicle vision system of claim 1,wherein said thermal element comprises a clip portion that clips ontosaid structure of said imager assembly to engage said first portion ofsaid thermal pad with said imager circuit board.
 3. The vehicle visionsystem of claim 2, wherein said clip portion is configured so that saidsecond portion of said thermal pad is angled relative to said firstportion of said thermal pad, and wherein, with said clip portion clippedonto said structure of said imager assembly and with said imagerassembly disposed at said housing of said camera module, said firstportion of said thermal pad extends partially along and is pressed intoengagement with said imager circuit board and said second portion ofsaid thermal pad extends partially along and is pressed into engagementwith said housing.
 4. The vehicle vision system of claim 2, wherein,with said clip portion clipped onto said structure of said imagerassembly, said first portion of said thermal pad is generally parallelto said imager circuit board.
 5. The vehicle vision system of claim 4,wherein, with said imager assembly disposed at said housing of saidcamera module, said second portion of said thermal pad is generallyparallel to said housing.
 6. The vehicle vision system of claim 1,wherein said thermal pad comprises a resilient material and iscompressed when engaged with said imager circuit board and said housing.7. The vehicle vision system of claim 1, wherein said thermal padcomprises a thermally conductive material to enhance heat transfer fromsaid imager circuit board to said housing.
 8. The vehicle vision systemof claim 1, wherein said structure supports said lens barrel and saidimager circuit board and is configured to mount said imager assembly atsaid housing.
 9. The vehicle vision system of claim 8, wherein saidstructure is configured to angle said imager circuit board relative toan upper wall of said housing, and wherein said thermal pad iscorrespondingly angled such that said first portion of said thermal padis generally parallel with said imager circuit board and said secondportion of said thermal pad is generally parallel with said upper wallof said housing.
 10. The vehicle vision system of claim 1, comprising abracket, wherein said bracket comprises an attachment portion configuredto attach at an in-cabin surface of the windshield of the equippedvehicle, and wherein, with said bracket attached at the in-cabin surfaceof the windshield, said camera module is mountable to said bracket. 11.A vehicle vision system comprising: a camera module configured to attachat an in-cabin surface of a windshield of a vehicle equipped with saidvision system; wherein said camera module comprises a housing and animager assembly; wherein said imager assembly comprises a structure andan imager and a lens, and wherein said imager is disposed at an imagercircuit board of said imager assembly; a thermal element configured toattach at said structure of said imager assembly, wherein said thermalelement comprises a support element and a thermal pad disposed at leastpartially along said support element; wherein, with said thermal elementattached at said structure of said imager assembly, a first portion ofsaid thermal pad is engaged with and in thermal conductivity with saidimager circuit board, and wherein, with said imager assembly disposed atsaid housing of said camera module, a second portion of said thermal padis engaged with and in thermal conductivity with said housing; whereinsaid thermal pad comprises a resilient material and is compressed whenengaged with said imager circuit board and said housing; and whereinsaid thermal pad comprises a thermally conductive material to enhanceheat transfer from said imager circuit board to said housing.
 12. Thevehicle vision system of claim 11, wherein said thermal elementcomprises a clip portion that clips onto said structure of said imagerassembly to engage said first portion of said thermal pad with saidimager circuit board.
 13. The vehicle vision system of claim 12, whereinsaid clip portion is configured so that said second portion of saidthermal pad is angled relative to said first portion of said thermalpad, and wherein, with said clip portion clipped onto said structure ofsaid imager assembly and with said imager assembly disposed at saidhousing of said camera module, said first portion of said thermal padextends partially along and is pressed into engagement with said imagercircuit board and said second portion of said thermal pad extendspartially along and is pressed into engagement with said housing. 14.The vehicle vision system of claim 12, wherein, with said clip portionclipped onto said structure of said imager assembly, said first portionof said thermal pad is generally parallel to said imager circuit board,and wherein, with said imager assembly disposed at said housing of saidcamera module, said second portion of said thermal pad is generallyparallel to said housing.
 15. The vehicle vision system of claim 11,wherein said structure supports said lens barrel and said imager circuitboard and is configured to mount said imager assembly at said housing.16. A vehicle vision system comprising: a bracket, wherein said bracketcomprises an attachment portion configured to attach at an in-cabinsurface of a windshield of a vehicle equipped with said vision system; acamera module, wherein, with said bracket attached at the in-cabinsurface of the windshield, said camera module is mountable to saidbracket; wherein said camera module comprises a housing and an imagerassembly; wherein said imager assembly comprises a structure and animager and a lens, and wherein said imager is disposed at an imagercircuit board of said imager assembly; wherein said structure supportssaid lens barrel and said imager circuit board and is configured tomount said imager assembly at said housing; a thermal element configuredto attach at said structure of said imager assembly, wherein saidthermal element comprises a support element and a thermal pad disposedat least partially along said support element; wherein, with saidthermal element attached at said structure of said imager assembly, afirst portion of said thermal pad is engaged with and in thermalconductivity with said imager circuit board, and wherein, with saidimager assembly disposed at said housing of said camera module, a secondportion of said thermal pad is engaged with and in thermal conductivitywith said housing; and wherein said structure is configured to anglesaid imager circuit board relative to an upper wall of said housing, andwherein said thermal pad is correspondingly angled such that said firstportion of said thermal pad is generally parallel with said imagercircuit board and said second portion of said thermal pad is generallyparallel with said upper wall of said housing.
 17. The vehicle visionsystem of claim 16, wherein said thermal element comprises a clipportion that clips onto said structure of said imager assembly to engagesaid first portion of said thermal pad with said imager circuit board.18. The vehicle vision system of claim 17, wherein said clip portion isconfigured so that said second portion of said thermal pad is angledrelative to said first portion of said thermal pad, and wherein, withsaid clip portion clipped onto said structure of said imager assemblyand with said imager assembly disposed at said housing of said cameramodule, said first portion of said thermal pad extends partially alongand is pressed into engagement with said imager circuit board and saidsecond portion of said thermal pad extends partially along and ispressed into engagement with said housing.
 19. The vehicle vision systemof claim 16, wherein said thermal pad comprises a resilient material andis compressed when engaged with said imager circuit board and saidhousing.
 20. The vehicle vision system of claim 16, wherein said thermalpad comprises a thermally conductive material to enhance heat transferfrom said imager circuit board to said housing.